The analysis of the charge transport mechanism of n-Si/MEH-PPV device structure using forward bias I-V-T characteristics

Kavasoğlu, Abdülkadir Sertap; Yakuphanoğlu, Fahrettin; Kavasoğlu, Neşe; Pakma, Osman; Birgi, Özcan; Oktik, Şener

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Date

2010-03-04

Author

Kavasoğlu, Abdülkadir Sertap
Yakuphanoğlu, Fahrettin
Kavasoğlu, Neşe
Pakma, Osman
Birgi, Özcan
Oktik, Şener

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Kavasoğlu, A. S., Yakuphanoğlu, F., Kavasoğlu, N., Pakma, O., Birgi, Ö., Oktik, Ş. (2010). The analysis of the charge transport mechanism of n-Si/MEH-PPV device structure using forward bias I-V-T characteristics. Journal of Alloys and Compounds, 492 (1/2), pp. 421-426. https://doi.org/10.1016/j.jallcom.2009.11.128

Abstract

In this study, temperature dependent current-voltage (I-V) measurements and investigation of the dc current transport mechanism of n-Si/MEH-PPV device have been performed. While the series resistance value displayed strongly temperature dependent behaviour, the ideality factor varied between 3.2 and 1.8 in the temperature range 110-330 K. The temperature dependent ideality factor behaviour at low temperature region (110-220 K) shows that tunnelling enhanced recombination is valid rather than thermionic emission theory and the characteristic tunnelling energy is calculated as 30 meV. There is a slightly linear relationship between the ideality factor and temperature at region II (230-330 K) which is attributed to drift-diffusion current transport in the n-Si/MEH-PPV device as stated already by Osvald.