Adıyaman, OktayDemir, Zülküf2019-06-212019-06-212019-04-15Adiyaman, O., & Demir, Z. (2019). Model and formulation in grinding mechanism having advanced secondary rotational axis. Measurement and Control, https://doi.org/10.1177/00202940198379880020-2940https://doi.org/10.1177/0020294019837988https://hdl.handle.net/20.500.12402/2081‘‘Grinding Mechanism having Advanced Secondary Rotational Axis’’ is one of the newer plane surface grinding methods that has an uncommon abrasion mechanism. Unlike conventional methods, in Grinding Mechanism having Advanced Secondary Rotational Axis, there are two rotations of a wheel. The first rotation is the same as the conventional grinding methods, which is the circumferential rotation. The other rotation is the newly developed axial rotation, where the wheel rotates around itself perpendicular to its radial axis. In the grinding process, the grinding force, energy, power, and temperature are directly related to the material removal rate. In this article, the chip model in Grinding Mechanism having Advanced Secondary Rotational Axis was addressed and material removal rate was reformulated. The new chip ratio formula was adapted to the grinding force, energy, power, and temperature in the conventional plane surface grinding method. The chip formed in the conventional plane surface grinding method consists of two-dimensional xy plane. In Grinding Mechanism having Advanced Secondary Rotational Axis, on the other hand, the chips consist of threedimensional xyz plane. The reason behind this is the second rotation obtained in Grinding Mechanism having Advanced Secondary Rotational Axis (axial rotational motion). The chip model was obtained from the combination of two rotations in Grinding Mechanism having Advanced Secondary Rotational Axis. As a result, the resulting chip model increased the material removal rate only slightly and this increase was negligible. Accordingly, an increase in grinding force, energy, power, and temperature was observed at negligible rates.eninfo:eu-repo/semantics/openAccessAttribution 3.0 United StatesMathematical Model in GrindingPlane Surface GrindingChip ModelGrinding Cut ParametersGrinding ForcesArticleQ2Q3