Güllü, ÖmerTurut, Abdulmecit2021-04-142021-04-142009-01Güllü, Ö., Turut, A. (2009). Electrical analysis of organic interlayer based metal/interlayer/semiconductor diode structures. Journal of Applied Physics. 106(10). https://doi.org/10.1063/1.3261835https://doi.org/10.1063/1.3261835https://hdl.handle.net/20.500.12402/2882In this work, metal/interlayer/semiconductor (MIS) diodes formed by coating of an organic film to p-Si semiconductor substrate were prepared. Metal(Al)/interlayer (phenolsulfonphthalein=PSP)/semiconductor(p-Si) MIS device had a good rectifying behavior. By using the forward bias I-V characteristics, the values of ideality factor (n) and barrier height (Phi(b)) for the Al/PSP/p-Si MIS diode were obtained as 1.45 and 0.81 eV, respectively. It was seen that the Phi(b) value of 0.81 eV calculated for the Al/PSP/p-Si MIS diode was significantly larger than value of 0.50 eV of conventional Al/p-Si Schottky diodes. Modification of the interfacial potential barrier of Al/p-Si diode was achieved by using a thin interlayer of the PSP organic material. This has been attributed to the fact that the PSP organic interlayer increases the effective barrier height by influencing the space-charge region of Si. The interface-state density of the MIS diode was determined, and the interface-state density was found to vary from 3.00 x 10(13) to 2.99 x 10(12) eV(-1) cm(-2). (C) 2009 American Institute of Physics.eninfo:eu-repo/semantics/openAccessAttribution-NonCommercial-ShareAlike 3.0 United StatesArticle10610N/AN/A