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Öğe On the energy distribution profile of interface states obtained by taking into account of series resistance in Al/TiO2/p–Si (MIS) structures(Elsevier, 2011-02-15) Pakma, Osman; Serin, Necmi; Serin, Saliha Tülay; Altındal, ŞemsettinThe energy distribution profile of the interface states (Nss) of Al/TiO2/pSi (MIS) structures prepared using the solgel method was obtained from the forward bias currentvoltage (IV) characteristics by taking into account both the bias dependence of the effective barrier height (φe) and series resistance (Rs) at room temperature. The main electrical parameters of the MIS structure such as ideality factor (n), zero-bias barrier height (φb0) and average series resistance values were found to be 1.69, 0.519 eV and 659 Ω, respectively. This high value of n was attributed to the presence of an interfacial insulator layer at the Al/pSi interface and the density of interface states (Nss) localized at the Si/TiO2 interface. The values of Nss localized at the Si/TiO2 interface were found with and without the Rs at 0.25-Ev in the range between 8.4×10 13 and 4.9×1013 eV-1 cm-2. In addition, the frequency dependence of capacitancevoltage (CV) and conductancevoltage (G/ω-V) characteristics of the structures have been investigated by taking into account the effect of Nss and R s at room temperature. It can be found out that the measured C and G/ω are strongly dependent on bias voltage and frequency.Öğe Electronic parameters of MIS Schottky diodes with DNA biopolymer interlayer(Walter de Gruyter, 2015-09-01) Güllü, Ömer; Türüt, AbdülmecitIn this work, we prepared an ideal Cu/DNA/n-InP biopolymer-inorganic Schottky sandwich device formed by coating a n-InP semiconductor wafer with a biopolymer DNA. The Cu/DNA/n-InP contact showed a good rectifying behavior. The ideality factor value of 1.08 and the barrier height (Φb) value of 0.70 eV for the Cu/DNA/n-InP device were determined from the forward ias I-V characteristics. It was seen that the Φb value of 0.70 eV obtained for the Cu/DNA/n-InP contact was significantly larger tan the value of 0.48 eV of conventional Cu/n-InP Schottky diodes. Modification of the interfacial potential barrier of Cu/n-InP iode was achieved using a thin interlayer of DNA biopolymer. This was attributed to the fact that DNA biopolymer interlayer increased the effective barrier height by influencing the space charge region of InP.Öğe The optical characterization of organometallic complex thin films by spectroscopic ellipsometry and photovoltaic diode application(Elsevier, 2016-05) Özaydın, Cihat; Güllü, Ömer; Pakma, Osman; İlhan, Salih; Akkılıç, KemalIn this work, organometallic complex (OMC) films have been deposited onto glass or silicon substrates by spin coating technique and their photovoltaic application potential has been investigated. Optical properties and thickness of the film have been investigated by spectroscopic ellipsometry (SE). Also, transmittance spectrum has been taken by UV/vis spectrophotometer. The optical method has been used to determine the band gap value of the films. Also, Au/OMC/n-Si metal/interlayer/semiconductor (MIS) diode has been fabricated. Current-voltage and photovoltaic properties of the structure were investigated. The ideality factor (n) and barrier height (Φb) values of the diode were found to be 2.89 and 0.79 eV, respectively. The device shows photovoltaic behavior with a maximum open-circuit voltage of 396 mV and a short circuit current of 33.8 μA under 300 W light.
